AM Technology co., Ltd

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製品紹介

Introducing AM Technology co., Ltd., a global leader in semiconductors and precision equipment.

レーザー事業部

[JAP] 레이저 사업부

ALDM-50

特徴

    ◆ Glass Hole Cutting with Nanosecond Green Laser

適用分野

 - Glass Encoder rough cut
 - Chemically Strengthened Glass Hole Drilling

仕様

 

Glass cutting by laser micro plasma processing   

 Laser source wavelength

 532nm

 Average power

10W 

 Peak power

50kW

 Stage

X x Y (500x500mm), Z (100mm)

Utility

Power : AC220, 3-phase

CDA 0.5Mpa, 30L/min 

 Dimensions (W x D x H)

1,400 x 1,390 x 2,250 mm

 Weight

Approx. 3,000kg

 Target material & Quality 

  Glass plate thickness

 Non-tempered glass : 0.1 mm ~ 30.0 mm

 Kerf width

180 ~ 600

 Size accuracy

±5  

 Positioning accuracy

 ±0.2

 Chipping size on cut edge

 < 150

 Roughness

 Ra < 10

Minimum radius on corner

Approx. 250

 Through-put

 < 3 mins. @ 18 x 18mm, 4.0T

 

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