ALDM-50
特徴
◆ Glass Hole Cutting with Nanosecond Green Laser
適用分野
- Glass Encoder rough cut
- Chemically Strengthened Glass Hole Drilling
仕様
Glass cutting by laser micro plasma processing |
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Laser source wavelength | 532nm |
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Average power |
10W |
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Peak power | 50kW |
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Stage | X x Y (500x500mm), Z (100mm) |
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Utility | Power : AC220, 3-phase CDA 0.5Mpa, 30L/min |
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Dimensions (W x D x H) |
1,400 x 1,390 x 2,250 mm |
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Weight | Approx. 3,000kg |
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Target material & Quality |
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Glass plate thickness |
Non-tempered glass : 0.1 mm ~ 30.0 mm |
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Kerf width |
180 ㎛~ 600 ㎛ |
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Size accuracy |
±5 ㎛ |
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Positioning accuracy |
±0.2 ㎛ |
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Chipping size on cut edge | < 150 ㎛ | ||
Roughness | Ra < 10 ㎛ | ||
Minimum radius on corner | Approx. 250 ㎛ | ||
Through-put | < 3 mins. @ 18 x 18mm, 4.0T | ||