Single Side Polishing Machine
特徴
◆堅牢な構造
◆Block Index System適用
◆最適化されたDMP/CMP Software
◆5段階の圧力、速度、時間調節
◆静圧方式のFacing System適用(DMP M/C)
◆自動Pad Cleaning System適用(CMP M/C)
適用分野
◆Wafers (Si, Sic, Ceramic, GaAs, Etc)
製品紹介
Introducing AM Technology co., Ltd., a global leader in semiconductors and precision equipment.
P&L事業部
[JAP] P&L사업부
仕様
Model |
36B4R |
50B4R |
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Ceramic Jig Size |
Ø360 |
Ø485 |
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Plate |
Size | DMP |
Ø910mm |
Ø1250mm |
|
CMP |
Ø910mm |
Ø1270mm |
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Material | DMP |
Pure/Resin copper, Metal Tin |
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CMP |
Stainless Steel | ||||
Wheel Spindle | DMP |
11kW |
20kW |
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CMP |
15kW | 25kW | |||
| Pressure Unit | Cylinder | 4 station | |||
Auto Facing Unit for | RPM | Min. 1mm/min~Max. 300mm/min | |||
Dimension | DMP | 1430(W) * 2340(D) * 2002(H)mm | 2260(W) * 3244(D) * 2830(H)mm | ||
CMP | 1430(W) * 1620(D) * 2162(H)mm | 2120(W) * 2700(D) * 2863(H)mm | |||
Weight | DMP | Approx. 3500kg | Approx. 7000kg | ||
CMP | Approx. 2500kg | Approx. 7000kg | |||