AM Technology co., Ltd

모바일 메뉴

製品紹介

Introducing AM Technology co., Ltd., a global leader in semiconductors and precision equipment.

P&L事業部

[JAP] P&L사업부

Single Side Polishing Machine

特徴

    ◆堅牢な構造 
    ◆Block Index System適用
    ◆最適化されたDMP/CMP Software
    ◆5段階の圧力、速度、時間調節
    ◆静圧方式のFacing System適用(DMP M/C)
    ◆自動Pad Cleaning System適用(CMP M/C)

適用分野

 

 

◆Wafers (Si, Sic, Ceramic, GaAs, Etc)

仕様

 Model

 36B4R

50B4R

Ceramic Jig Size

Ø360

Ø485 

Plate

 Size

DMP 

 Ø910mm

Ø1250mm

CMP

 Ø910mm

Ø1270mm

Material

DMP

 Pure/Resin copper, Metal Tin

CMP

 Stainless Steel

 Wheel Spindle

DMP

11kW

20kW

CMP

15kW

25kW

Pressure UnitCylinder  4 station

 Auto Facing Unit for

RPM

Min. 1mm/min~Max. 300mm/min 

 Dimension

DMP 

1430(W) * 2340(D) * 2002(H)mm  

2260(W) * 3244(D) * 2830(H)mm  

CMP

1430(W) * 1620(D) * 2162(H)mm  

2120(W) * 2700(D) * 2863(H)mm   

 Weight

DMP 

Approx. 3500kg 

Approx. 7000kg 

CMP

Approx. 2500kg

Approx. 7000kg

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