AM Technology co., Ltd

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Company

Introducing AM Technology co., Ltd., a global leader in semiconductors and precision equipment.

Overview and History

Overview and History of AM Technology.

Take-off Stage
2018 ~ 2008

2018
  • 01Developed, marketed of Titing Type Vertical Rotary Grinding Machine (VRG-500N)
2016
  • 10Developed and marketed of Full Auto Fly Cut Machine (AFC-200)
2014
  • 02Developed and marketed of Full Auto Dicing Saw (ADS-200A) facility
  • 01Developed and marketed of Full Auto Vertical Rotary Grinding Machine (VRG-300A)
2013
  • 01Developed and marketed of Fully Auto Fine Grinding facility (ADG-600F)
2012
  • 10Developed and marketed of Sapphire Wafer Double-sided DMP, CMP equipment
2011
  • 09Factory expansion
2009
  • 02Relocated to Asan Techno Valley
2008
  • 11Signed contract to introduce laser cutting technology (Russia)
  • 08Developed ultra-precision Multi- Dicing Machine
  • 07Developed CNC glass chamfering machine

Growth stage
2007 ~ 2000

2007
  • 08Established Japanese office
2005
  • 03Acquired ISO 9001-14001 certification
2003
  • 11Relocated the company to Banwol Industrial Complex
  • 07Developed Fully Automatic 200mm Wafer Dicing Machine
2002
  • 12Established Beijing office
  • 07Renamed the company AM Technology Co., Ltd.
2001
  • 09Relocated the company to Sihwa Industrial Complex
2000
  • 07Established the company research lab

Establishment Stage
1994 ~ 1998

1998
  • 03Exported Double-sided Lapping Machine
1997
  • 12Developed and marketed Auto Dicing Saw machine
  • 07Developed and marketed of Double-sided Lapping Machine
1996
  • 04Developed and marketed of Back Grinding Machine
1994
  • 07Developed and marketed of Single-sided Lapping Machine
  • 05Established Alpha Precision

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