Take-off Stage
2018 ~ 2008
- 2018
-
- 01Developed, marketed of Titing Type Vertical Rotary Grinding Machine (VRG-500N)
- 2016
-
- 10Developed and marketed of Full Auto Fly Cut Machine (AFC-200)
- 2014
-
- 02Developed and marketed of Full Auto Dicing Saw (ADS-200A) facility
- 01Developed and marketed of Full Auto Vertical Rotary Grinding Machine (VRG-300A)
- 2013
-
- 01Developed and marketed of Fully Auto Fine Grinding facility (ADG-600F)
- 2012
-
- 10Developed and marketed of Sapphire Wafer Double-sided DMP, CMP equipment
- 2011
-
- 09Factory expansion
- 2009
-
- 02Relocated to Asan Techno Valley
- 2008
-
- 11Signed contract to introducelaser cuttingtechnology (Russia)
- 08Developed ultra-precision Multi-Dicing Machine
- 07Developed CNC glass chamfering machine
