LASER GLASS HOLE DRILLING MACHINE
特點
◆ Glass Hole Drilling with Nanosecond Green Laser
應用領域
◆ Target glass : Chemically Tempered Glass, Non-Tempered Glass
产品介绍
为大家介绍半导体、精密设备领域的全球引领者AM科技有限公司。
激光事业部
[CHN] 레이저 사업부
產品規格
Glass cutting by laser micro plasma processing |
|||
Laser source wavelength | 532nm |
||
Average power |
10W |
||
Peak power | 50kW |
||
Stage | X x Y (500x500mm), Z (100mm) |
||
Utility | Power : AC220, 3-phase CDA 0.5Mpa, 30L/min |
||
Dimensions (W x D x H) |
1,400 x 1,390 x 2,250 mm |
||
Weight | Approx. 3,000kg |
||
Target material & Quality |
|||
Glass plate thickness |
Non-tempered glass : 0.1 mm ~ 30.0 mm |
||
Kerf width |
180 ㎛~ 600 ㎛ |
||
Size accuracy |
±5 ㎛ |
||
Positioning accuracy |
±0.2 ㎛ |
||
Chipping size on cut edge | < 150 ㎛ | ||
Roughness | Ra < 10 ㎛ | ||
Minimum radius on corner | Approx. 250 ㎛ | ||
Through-put | < 3 mins. @ 18 x 18mm, 4.0T | ||