Full Auto Back Grinding Machine
Feature
◆ Substantial and Simple Structure
◆ Auto Workpiece Thickness Measure system
◆ Auto Dressing system
◆ Auto Loading/Unloading system
◆ Auto Cleaning & Dry
◆ Optimized Software
Applications
◆Semiconductor Packaging: Strip mold & Composite, Fan-out wafer level package, PLP, PCB board, Finger print
◆Wafer Processing: Silicon wafer, Sic wafer, Sapphire
◆Etc: Ceramic, Metal, Glass, Si ring, Electrode, LED mold, Carbons, Plastic