AM Technology co., Ltd

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About Products

Introducing AM Technology co., Ltd., a global leader in semiconductors and precision equipment.

P&L Division

[ENG] P&L사업부

Single Side Polishing Machine

Feature

    ◆Strong Structure

    ◆Automatic Block Index System

    ◆Optimized DMP/CMP Software

    ◆5steps control-Pressure,Speed,Time

    ◆Hydro-static Facing System for DMP

    ◆Automatic Pad Cleaning System for CMP

Applications

◆Wafers (Si, Sic, Ceramic, GaAs, Etc)

Specifications

 Model

 36B4R

50B4R

Ceramic Jig Size

Ø360

Ø485 

Plate

 Size

DMP 

 Ø910mm

Ø1250mm

CMP

 Ø910mm

Ø1270mm

Material

DMP

 Pure/Resin copper, Metal Tin

CMP

 Stainless Steel

 Wheel Spindle

DMP

11kW

20kW

CMP

15kW

25kW

Pressure UnitCylinder  4 station

 Auto Facing Unit for

RPM

Min. 1mm/min~Max. 300mm/min 

 Dimension

DMP 

1430(W) * 2340(D) * 2002(H)mm  

2260(W) * 3244(D) * 2830(H)mm  

CMP

1430(W) * 1620(D) * 2162(H)mm  

2120(W) * 2700(D) * 2863(H)mm   

 Weight

DMP 

Approx. 3500kg 

Approx. 7000kg 

CMP

Approx. 2500kg

Approx. 7000kg

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