AM Technology co., Ltd

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About Products

Introducing AM Technology co., Ltd., a global leader in semiconductors and precision equipment.

P&L Division

[ENG] P&L사업부

Double Side Lapping/Polishing Machine

Feature

    ◆Anti-Vibration design

    ◆Optimized frame for Double Side CMP

    ◆Hydro-Static Facing Unit for DMP

    ◆Self Re-conditioning to save time for DMP

    ◆Optimized Pressure-Control system applied

    ◆Optimized DMP/CMP software

Applications

◆Wafers (Si, Sic, Ceramic, GaAs, Etc)

Specifications

 Model

 ADP-1605(DMP)

 ADP-1605(CMP)

Wheel Diameter

 mm

Ø1150

Ø1154

 Carrier Size

 mm

 16B 5L

 16B 5L

Max. Load Pressure 

 kgf

1000

1000

 Upper Wheel

 Drive

 kW

11

11

 Speed

rpm

40

40

 Lower Wheel

 Drive

kW

11

15

 Speed

rpm

40

40

 Inner Gear

 Drive

kW

3

 Speed

rpm

25

25

 Outer Gear

 Drive

kW

3

 Speed

rpm

13

13

 Dimension

 mm

1820*3050*2520

1820*2730*2520 

 Weight

 kg

 8000

7500 

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